FPGA USB 2.0 Module Accelerates Development Time

Oct. 8, 2008
Promising to speed development engineering, prototyping, and OEM integration times, the XEM3050 module integrates a 4,000,000-gate Xilinx Spartan-3 FPGA and employs a USB 2.0 for high-speed data transfers. It also packs SDRAM, flash memory, SSRAM,

Promising to speed development engineering, prototyping, and OEM integration times, the XEM3050 module integrates a 4,000,000-gate Xilinx Spartan-3 FPGA and employs a USB 2.0 for high-speed data transfers. It also packs SDRAM, flash memory, SSRAM, power supplies, and comprehensive I/O. Module control is via the company’s FrontPanel software and API. Typical use for the XEM3050 is turnkey device-to-computer integration for logic-heavy applications such as image capture and signal processing, data acquisition, and digital communication. Measuring smaller than a credit card, the module includes 64-MB of SDRAM, 8-Mb of SPI flash memory, 512k x 18 synchronous SRAM, and two switching power supplies. FrontPanel software handles all the interaction between user software and the FPGA design. Single-unit price is $749.95 OPAL KELLY INC., Portland, OR.

Company: OPAL KELLY INC.

Product URL: Click here for more information

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