PCB Placement Tool Fits In With Layout Editors

July 9, 2007
DesignAdvance’s CircuitSpace PC-board placement tool, now available from EMA Design Automation, provides improved communications between hardware engineers and layout designers. CircuitSpace seamlessly integrates with Cadence’s Allegro and/or OrCAD PCB

DesignAdvance’s CircuitSpace PC-board placement tool, now available from EMA Design Automation, provides improved communications between hardware engineers and layout designers. CircuitSpace seamlessly integrates with Cadence’s Allegro and/or OrCAD PCB layout editors, and allows users to achieve board layouts in a fraction of the time it would take to complete by hand.

Component placement is time-consuming and has traditionally proven to be difficult to automate. With component counts on the rise and 10,000-part boards becoming commonplace, managing placement becomes more difficult and can take months to complete.

CircuitSpace implements a hierarchical approach to printed-circuit-board design through enhanced autoclustering and replication technologies. The tool also expedites the design process via template generation for global library usage across divisions, template usage with and without etch, automated layout reference designator propagation, and automated change report between layout designs.

Contact EMA Design Automation directly for pricing and delivery information.

EMA Design Automation

www.ema-eda.com

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

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