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1,200-V SiC MOSFETs Feature Compact Packaging with Topside Cooling

April 16, 2025

Nexperia’s new X.PAK packaging combines high thermal performance, compact size, and easy assembly for high-power applications.

Lee Goldberg

Related To:

Electronic Design

At APEC 2025, Nexperia announced several important additions to its portfolio of enhancement-mode GaN and SiC devices. Among them is a new series of 1,200-V SIC MOSFETs available in thermally enhanced packaging for high-power, high-performance applications.

The new X.PAK package builds on some of the topside-cooling concepts developed by STMicroelectronics to provide extremely effective cooling within its compact form factor of 14 × 18.5 mm. In addition to topside cooling, the MOSFETs support heat dissipation via the PCB they’re mounted on. This suits them for industrial applications such as battery energy storage systems (BESS), photovoltaic inverters, motor drives, EV chargers, and uninterruptible power supplies (UPS).

Nexperia's X.PAK package also features an improved die connection technique, eliminating the need for bond wires and their associated parasitic effects. This leads to low inductance for surface-mount components and supports automated board assembly. It also makes it much easier for designers to create high-power outputs by connecting multiple devices in parallel without having to painstakingly match their electrical characteristics.

The advanced packaging, combined with the devices’ inherently high thermal stability, helps minimize the rise in R_DS(on) they experience as output currents ramp up.

The initial portfolio includes products with RDS(on) values of 30, 40, and 60 mΩ (the NSF030120T2A0, NSF040120T2A1, and NSF060120T2A0, respectively); a part with 17 mΩ will be released in April 2025. An automotive-qualified SiC MOSFET portfolio in X.PAK packaging will follow later in 2025, as well as further R_DS(on) classes like 80 mΩ.

^{>>Check out more of our APEC 2025 coverage}

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About the Author

Lee Goldberg | Contributing Editor

Lee Goldberg is a self-identified “Recovering Engineer,” Maker/Hacker, Green-Tech Maven, Aviator, Gadfly, and Geek Dad. He spent the first 18 years of his career helping design microprocessors, embedded systems, renewable energy applications, and the occasional interplanetary spacecraft. After trading his ‘scope and soldering iron for a keyboard and a second career as a tech journalist, he’s spent the next two decades at several print and online engineering publications.

Lee’s current focus is power electronics, especially the technologies involved with energy efficiency, energy management, and renewable energy. This dovetails with his coverage of sustainable technologies and various environmental and social issues within the engineering community that he began in 1996. Lee also covers 3D printers, open-source hardware, and other Maker/Hacker technologies.

Lee holds a BSEE in Electrical Engineering from Thomas Edison College, and participated in a colloquium on technology, society, and the environment at Goddard College’s Institute for Social Ecology. His book, “Green Electronics/Green Bottom Line - A Commonsense Guide To Environmentally Responsible Engineering and Management,” was published by Newnes Press.

Lee, his wife Catherine, and his daughter Anwyn currently reside in the outskirts of Princeton N.J., where they masquerade as a typical suburban family.

Lee also writes the regular PowerBites series.