Latest from Power

ID 181475306 © Александр Марко | Dreamstime.com
Flying taxi, transport drone
ID 217230663 © Christian Offenberg - Dreamstime.com | electronica.de
promo_messe_munich__id_217230663__christian_offenb
ID 39977536 © Pino Carboni | Dreamstime.com
Transformers on a PCB
ID 319909889 © Media Whalestock | Dreamstime.com
Needles on automatic test equipment
325988743 © aleksei todosko | Dreamstime.com
id_325988743__aleksei_todosko__dreamstime
ID 10638070 © Brian Hoffman | Dreamstime.com
Wind turbines in approaching storm
Dreamstime_kpixmining_229797125
dreamstime_kpixmining_229797125
Dreamstime_Yuriy-Nedopekin_162481374
Pcb Dreamstime Yuriy Nedopekin 162481374 Promo 6376600f8ce69

How to Achieve Higher Power Density and Better Thermal Performance in PSUs (Download)

Dec. 7, 2022

Read this article online.

Around here we sit through many presentations about miniaturization of components and performance efficiencies realized at the same time. We also hear about the effort spent on reducing the size of passives used for energy conversion as inductors, capacitors, and transformers typically take up a large portion of the solution size.

For engineers, all of this means more attention must be paid to thermal management and the junction temperature of semiconductor devices, which handle the conversion of power to a usable form. After all, when a device is running, it consumes electrical energy that’s transformed into heat. And if this heat isn’t properly controlled, it can negatively affect efficiency or even damage the board.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!