Mar. 25, 2024 - Electronic Design Today

Developed by Texas Instruments, this IC initiates battery cutoff via a pyro, non-thermal fusing device.

The Strato Pi Max, developed by Sfera Labs, leverages the Compute Module 4 to facilitate migration of Raspberry Pi-based application prototypes as well as offer a range of functionality...

This edition of PowerBites brings you new developments in hybrid-electric aircraft and a V2G standard, MOSFET moves, silicon and SiC advances, plus more.

Seamless management of multiple OS in automotive environments is possible with BlackBerry’s QNX Hypervisor that integrates VirtIO support.

The latest Blackwell GPU is the result of innovations in everything from the transistors themselves to the architecture, advanced packaging, connectivity, and memory.

When it comes to chiplets, it’s all about packaging technology.

Several hybrid-electric aircraft are nearing commercial production, perhaps changing the economics of regional, short-haul, and air taxi services. Here's a look at what makes ...

TI leverages its integrated transformer technology in its latest isolated DC-DC power module, which is claimed to be close to 90% more compact than comparable solutions.

Sponsored by Texas Instruments: EV charging and distributed solar-energy apps are driving the demand for ultra-precision sensing, which includes the use of Hall-effect sensors...

Part 2 compares the characteristics of linear and multichannel receiver devices, examining resolution capabilities and sensitivity to impulse noise as well as the relationships...

Infineon’s new series of solid-state isolators facilitate faster and more reliable switching in high-voltage electronics.

Wrapping up the 2024 Chiplet Summit, this panel session discussed the huge advantages and persistent challenges presented by chiplets.

Sponsored by Texas Instruments: Innovative semiconductor technologies are playing a pivotal role in the development of safety and efficiency in electric-vehicle BMS.

Stellantis’s (Chrysler) first BEV vehicle, scheduled as a 2025 model, will be built on the STLA Large platform, which targets a 500-mile EV range. Fast charging will add up to...

Teledyne LeCroy is upgrading its CrossSync PHY technology, which connects oscilloscopes to protocol analyzers in real-time, for the PCIe Gen 6 standard.

Power-hungry AI accelerators and other high-performance chips are throwing a wrench into power integrity. Learn how Picotest is trying to tackle the challenges with more advanced...