At DAC, Arteris featured its system IP, which includes its network-on-chip interconnect IP and system-on-chip integration automation software to help boost product performance...
Advances in thermal-interface gels for thermal cooling and sealing apps give them advantages over gap-filler pads. Understand the differences and learn at what volume it might...
Sponsored by Texas Instruments: Proper PCB layout is vital in terms of dissipating heat. An innovative flip-chip QFN packaging technology is helping achieve that goal.
In this real-world example, computational-fluid-dynamic software was used to simulate all packaging levels in a system design in order to minimize heat and improve acoustics.
