Sponsored by Texas Instruments: Thanks to an innovative packaging scheme, this power module gives designers room to maximize performance in ever-smaller applications.
To handle the increasing communications load in cars, manufacturers are supplementing legacy CAN and LIN networks by adding Ethernet ports with data rates of 100 megabits to 1...
Combining low quiescent current with EMI-mitigating features, a power-management IC overcomes power design challenges in automobile instrument clusters, telematics, and head-up...
Intel has been investing in its advanced packaging prowess, including 3-D chip stacking technology, in recent years in a bid to repel rivals in personal computers and data centers...
Can LED drivers be too smart? Can QJTs become reality? A dc-dc converter that extends battery lifetime by 50%? Find out the answers to these questions in the latest edition of...
The potential reach of 5G into applications across all industries, let alone its speed, will demand test equipment that can handle mmWave frequencies and advanced RF and beamforming...
With more focus on renewable energy, wind power—including the turbines and the technology behind them—continues to receive more attention. Vibration is a critical factor in their...
GaN and silicon living together in the same package? That’s the case with STMicro's integrated half-bridge/driver, which promises significant size and weight reductions in a variety...
The LTC6373 features 25-pA input bias current along with other superior specifications that complement its function as a precision amplifier for challenging signal-conditioning...
How can IT scale storage architectures and produce higher-density, TCO-optimized storage with increasing data-storage demands and diverse workloads? Zoned Storage.