Feb. 14, 2022 - Electronic Design Today

Here are some notable new products to consider for your next design project.

This article shares some PCB assembly standards that one should follow to ensure a successful PCBA project, as well as revealing some benefits of the IPC standards.

Today’s device builders are scrambling to create feature-rich connected devices with digital experiences around them. But developers face challenges when adopting technology for...

This two-part series presents validated SMPS designs for remote-patient vital sign monitoring applications, including biosensors with excellent system signal-to-noise performance...

What are the challenges of collecting operating data in the form of data logs from increasingly complex industrial robotic systems? This article looks at how to handle the massive...

CTSD ADCs bring out architectural benefits and simplify signal-chain design to reduce solution size and help achieve faster time to market. This article series explains the benefits...

The devices were developed to deliver up to 70 W for air conditioners, body control electronics, and other vehicle subsystems.

Sponsored by Texas Instruments: Meeting more stringent regulatory guidelines in terms of ADAS functionality, particularly corner turning, requires more sophisticated sensors. ...

The company said that it would see "incremental improvements" to its supply throughout the year thanks in part to its dual-sourcing strategy for some chips.

The intersection of AI and real-time data, in concert with the industrial IoT, will continue to provide a more holistic view and control over the supply chain, and with any luck...

A small protection device such as this dual SPST IC switch can provide major benefits and prevent further damage to sensitive front ends when faults occur.

NAND flash SSDs are generally accepted as universal storage devices. Nevertheless, many things can go wrong if you don’t choose the right SSD for your application. This article...

NXP is forging closer ties with its customers, giving it confidence that the automotive chip boom will outlast the current supply crisis.

By manipulating carbon nanotubes, a team has developed fibers that can harvest thermoelectric-based energy from fabrics.

MathWorks’ Heather Gorr explains how engineers can apply artificial intelligence to real-time engineering decisions, as well as the issues involving data synchronization.

Reconfigurable intelligent surfaces (RIS) leverage smart radio surfaces with thousands of small metamaterial elements that dynamically shape and control RF signals.

Designed for automotive-grade mass production, the first of Pony ai’s self-driving vehicles equipped with NVIDIA’s DRIVE Orin will begin road testing in China this year.

Electronics companies reported orders, shipments, and production output are growing. But the report released by the IPC signaled that they are using up components almost as soon...

Check out Blink Charging's new offerings, which were presented at this year's Consumer Electronics Show.

We talk about DARPA’s Toolbox Initiative with Serge Leef, program manager for DARPA’s Design Automation & Secure Hardware Organization, and Richard Powlowsky, Director, Government...

NXP Semiconductor's Matthias Feulner presents the company's 4D imaging radar chips for Level 2+ ADAS support.