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    • Cool Designs

    There are many ways to keep a design cool including heat pipes and vapor chambers
    ZutaCore
    promo_dellxe9680retrofit
    Feb. 6, 2025
    The next generation of high-performance CPUs and GPUs targeting the demanding needs of AI and HPC will generate a significant amount of heat, making efficient cooling solutions...
    Dreamstime_oleksandrlutsenko_2220932
    Modern military and industrial electronics systems need advanced thermal management.
    Dec. 2, 2024
    Thermal management is critical for rugged-systems design, where SWaP-C (size, weight, power, and cost) constraints require innovative cooling strategies.
    Supermicro
    promo_supermicro
    Oct. 30, 2024
    Not only do massive clusters of GPUs require major amounts of power, but also a cooling system that can handle it all. That's where the xAI Colossus steps in.
    Newark
    May 22, 2024
    Electronically commutated (EC) fans enhance electronics cooling while using significantly less power and, in turn, promoting energy efficiency.
    Surasak_petchang_dreamstime
    Jan. 25, 2024
    A unique peel-and-stick thermal sensor works to keep the high-voltage battery packs in EVs from overheating—and potentially from exploding into flames.

    More content from Cool Designs

    Frore Systems
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    Oct. 19, 2023
    Frore Systems takes advantage of MEMS to blur the lines between active and passive cooling technology.
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    This presentation delves into heat pipes and vapor chambers that might benefit your application.
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    Sponsored by Texas Instruments: Shrinking power supplies inevitably leads to problems with heat. However, a multifaceted approach to mitigate these issues, including innovative...
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    Cooling a device using a thermal interface material (TIM) is a good idea but not foolproof. Still, one particularly effective alternative worth pursuing is the phase-change TIM...
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    TI's Dorian Brillet de Cande provides tips and details for dc/dc converter designers.
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    July 11, 2022
    For the ultimate in heat spreading, consider plating the entire board and its components with a thin copper layer.
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    March 31, 2022
    The latest advanced electronics face many challenges. Not only do they need to be lightweight and rugged, they must also address thermal management and efficiency. We talk to ...
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    May 22, 2020
    To overcome the heat problems in the cramped interiors of data-center equipment, engineers went a different route and put a new twist on the gap pad.
    What’s the Difference Between Heat Pipes and Vapor Chambers?
    Oct. 12, 2017
    Although both operate on the same basic principles, their manufacturing process and design flexibility are different. In fact, you can think of vapor chambers as large planar ...
    Thermal-Designing Your Way to a Cooler High-Performance Tablet
    May 18, 2017
    In this real-world example, computational-fluid-dynamic software was used to simulate all packaging levels in a system design in order to minimize heat and improve acoustics.
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    May 30, 2013
    Advanced materials and adhesives are often the keys to effective thermal management. This article covers a wide variety of thermal interface materials and explains what design...
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    Today's and tomorrow's miniaturized power packages require thermal and electrical pathways into the board. Here are a number of approaches involving current, thermal, ...
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    Thermoelectric coolers (TECs) are versatile temperature control devices. They’re best thought of as solid-state heat pumps in which the direction and rate of heat flow can be ...