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    There are many ways to keep a design cool including heat pipes and vapor chambers
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    Modern military and industrial electronics systems need advanced thermal management.
    Boards

    Overcome Thermal-Management Challenges in Rugged-System Design to Optimize SWaP-C

    Dec. 2, 2024
    Thermal management is critical for rugged-systems design, where SWaP-C (size, weight, power, and cost) constraints require innovative cooling strategies.
    Supermicro
    promo_supermicro
    Systems

    Liquid Cooling Dials Down AI Supercomputer Heat

    Oct. 30, 2024
    Not only do massive clusters of GPUs require major amounts of power, but also a cooling system that can handle it all. That's where the xAI Colossus steps in.
    Newark
    Power

    EC Fans Make Cooling More Efficient and Sustainable

    May 22, 2024
    Electronically commutated (EC) fans enhance electronics cooling while using significantly less power and, in turn, promoting energy efficiency.
    Surasak_petchang_dreamstime
    Power

    Thermal-Monitoring "Tape" Helps EV Batteries Beat the Heat

    Jan. 25, 2024
    A unique peel-and-stick thermal sensor works to keep the high-voltage battery packs in EVs from overheating—and potentially from exploding into flames.
    Frore Systems
    Frore Promo
    Embedded

    Startup Taps MEMS Cooling to Turn Down the Heat in Electronic Devices

    Oct. 19, 2023
    Frore Systems takes advantage of MEMS to blur the lines between active and passive cooling technology.

    More content from Cool Designs

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    Thermal Management

    Heat Pipe Design Guidelines for Better Thermal Designs

    Aug. 18, 2023
    This presentation delves into heat pipes and vapor chambers that might benefit your application.
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    Learning Resources

    How to Achieve Higher Power Density and Better Thermal Performance in PSUs

    Jan. 3, 2023
    Sponsored by Texas Instruments: Shrinking power supplies inevitably leads to problems with heat. However, a multifaceted approach to mitigate these issues, including innovative...
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    Power

    Thermal Interface Materials: Cool Options for Better Power Density

    Oct. 17, 2022
    Cooling a device using a thermal interface material (TIM) is a good idea but not foolproof. Still, one particularly effective alternative worth pursuing is the phase-change TIM...
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    Power Supply

    Electronic Design Presents Thermal Design for Modern DC/DC Converters

    Sept. 13, 2022
    TI's Dorian Brillet de Cande provides tips and details for dc/dc converter designers.
    Schweber Promo 1
    Automation

    Conformal-Copper Coating Transforms Component into Its Own Heat Spreader

    July 11, 2022
    For the ultimate in heat spreading, consider plating the entire board and its components with a thin copper layer.
    Capture
    Thermal Management

    Thermal Management is Critical in Advanced Electronics

    March 31, 2022
    The latest advanced electronics face many challenges. Not only do they need to be lightweight and rugged, they must also address thermal management and efficiency. We talk to ...
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    Automation

    Thermal Management: New Solutions for New Challenges

    May 22, 2020
    To overcome the heat problems in the cramped interiors of data-center equipment, engineers went a different route and put a new twist on the gap pad.
    What’s the Difference Between Heat Pipes and Vapor Chambers?
    Components

    What’s the Difference Between Heat Pipes and Vapor Chambers?

    Oct. 12, 2017
    Although both operate on the same basic principles, their manufacturing process and design flexibility are different. In fact, you can think of vapor chambers as large planar ...
    Thermal-Designing Your Way to a Cooler High-Performance Tablet
    Embedded

    Thermal-Designing Your Way to a Cooler High-Performance Tablet

    May 18, 2017
    In this real-world example, computational-fluid-dynamic software was used to simulate all packaging levels in a system design in order to minimize heat and improve acoustics.
    Image
    Power

    Thermal-Management Design Banks On Advanced Materials/Adhesives

    May 30, 2013
    Advanced materials and adhesives are often the keys to effective thermal management. This article covers a wide variety of thermal interface materials and explains what design...
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    Thermal Management

    Metal in the Board: Meeting the Challenge of Digital Power

    May 29, 2013
    Today's and tomorrow's miniaturized power packages require thermal and electrical pathways into the board. Here are a number of approaches involving current, thermal, ...
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    Components

    Simple design equations for thermoelectric coolers

    Feb. 23, 1998
    Thermoelectric coolers (TECs) are versatile temperature control devices. They’re best thought of as solid-state heat pumps in which the direction and rate of heat flow can be ...