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  • November 18, 2024 - Electronic Design Today

    • November 18, 2024 - Electronic Design Today

    ID 217230663 © Christian Offenberg - Dreamstime.com | electronica.de
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    Events

    Tech Highlights @ electronica 2024

    Dec. 6, 2024
    Check out our coverage of technology and products at electronica 2024.
    ID 169214712 © Petrsvoboda91 | Dreamstime.com
    Focus at SSD slot, type M.2 with support for NVMe, on computer motherboard.
    Memory

    New Memories Making Meaningful Strides

    Nov. 20, 2024
    Non-volatile technologies like MRAM and particularly ReRAM are poised to finally take a major leap into the embedded-memory design space.
    ID 321264446 © Studioclever | Dreamstime.com
    Generative AI in the data center
    Nonlinearities

    Could Sagence AI’s Analog Inferencing for GenAI be NVIDIA’s Downfall?

    Nov. 19, 2024
    AI data centers typically require hundreds of megawatts of power, and it continues to rise to the point where most power companies refuse to provide such capacity from the public...
    Sparkfun, Mikroe, Digilent, Digi International
    Peripheral modules with popular form factors
    Embedded

    Peripheral Connections for Prototyping

    Nov. 19, 2024
    Rapid prototyping requires quick access to new peripherals—de facto standards can help.
    ID 89436090 © Vaclav Volrab | Dreamstime.com
    Micro-reactors for AI processing in data centers
    Inside Electronics

    NANO Nuclear’s 5-MW Electricity Generator in a Shipping Container

    Nov. 19, 2024
    James Walker, CEO of NANO Nuclear, discusses the advent of micro-reactor systems, including the company’s commercial designs that output up to 5 MW.

    More content from November 18, 2024 - Electronic Design Today

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    Modeling on Mondays: SPICE Modeling of Common Active Devices—An Overview (Part 1)

    Nov. 18, 2024
    Engineering is all about choosing the best compromise—both for a SPICE model that provides reasonable fidelity and for the tools enabling that model to be employed.
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    Ultra-Thin Silicon Wafers Wring More from Power Electronics

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    According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.
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    What’s the Difference Between Silicon Solar Panels and Emerging Solar-Cell Tech?

    Nov. 15, 2024
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    Software-defined vehicles: the cars of the future
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    Software-Defined Vehicles: The Future of the Automotive Industry

    Nov. 15, 2024
    Sponsored by Texas Instruments: The poster child for new automotive technology is a dynamic, adaptable system that allows for continuous improvements to the driving experience...
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    IO-Link transceiver for the factory floor
    Analog

    Startup Launches IO-Link Transceiver to Connect the Factory Floors of the Future

    Nov. 13, 2024
    Orca’s OS2000 leverages the IO-Link standard to enable seamless, bidirectional communication between sensors and industrial control systems in factories.
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    Cell towers
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    Tiny Non-Reflective RF Switch Pushes to 50 GHz

    Nov. 12, 2024
    Solid-state RF switches continue to advance their performance contour in both electrical specifications and physical size.
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    Renesas Introduces AnalogPAK Mixed-Signal Baby-FPGAs

    Nov. 12, 2024
    Four new members were added to the AnalogPAK programmable mixed-signal IC product family: the SLG47011, SLG47001, SLG47003, and automotive-grade SLG47004-A.
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    What’s The Difference Between Bit Rate And Baud Rate?

    Nov. 12, 2024
    Serial-data speed is usually stated in terms of bit rate. However, another oft-quoted measure of speed is baud rate. Though the two aren’t the same, similarities exist under some...
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    Embarking on a New Frontier of Power Density with GaN

    Nov. 11, 2024
    The latest power-conversion devices will help engineers achieve higher power in smaller spaces, thus providing the highest power density at lower cost.
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    Processors

    Multicore Micro Targets Software-Defined Vehicle Tasks

    Nov. 11, 2024
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    Where Isolation Fits into Next-Gen Power Electronics

    Nov. 8, 2024
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    Satellite IoT-NTN GNSS Module Addresses Remote Connectivity

    Nov. 7, 2024
    The SARA-S528NM10 expands the company’s cellular portfolio for the satellite IoT market, based on the 3GPP Rel 17 specification for global connectivity.
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    11 Myths About Electric-Vehicle Batteries

    Nov. 4, 2024
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    Automotive

    Examining EV Charging Infrastructure Issues

    Nov. 1, 2024
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    Current Sensors Evolve to Elevate EV Battery-Management Accuracy

    Oct. 28, 2024
    Learn more about the single monitoring unit (SMU) from LEM and how it could facilitate higher-accuracy, intelligent battery management in EVs.
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    Dealing with Diagnostics, Documentation, and Debugging

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