AI data centers typically require hundreds of megawatts of power, and it continues to rise to the point where most power companies refuse to provide such capacity from the public...
Engineering is all about choosing the best compromise—both for a SPICE model that provides reasonable fidelity and for the tools enabling that model to be employed.
According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.
Crystalline-silicon solar panels are efficient, reliable, and dominate the solar-panel market. However, new third-gen solar technology could do what c-Si solar panels cannot, ...
Sponsored by Texas Instruments: The poster child for new automotive technology is a dynamic, adaptable system that allows for continuous improvements to the driving experience...
Orca’s OS2000 leverages the IO-Link standard to enable seamless, bidirectional communication between sensors and industrial control systems in factories.
Four new members were added to the AnalogPAK programmable mixed-signal IC product family: the SLG47011, SLG47001, SLG47003, and automotive-grade SLG47004-A.
Serial-data speed is usually stated in terms of bit rate. However, another oft-quoted measure of speed is baud rate. Though the two aren’t the same, similarities exist under some...
The latest power-conversion devices will help engineers achieve higher power in smaller spaces, thus providing the highest power density at lower cost.
Galvanic isolation is imperative in everything from onboard chargers in EVs to the power electronics feeding AI chips in data centers, said Skyworks’ John Wilson.
The SARA-S528NM10 expands the company’s cellular portfolio for the satellite IoT market, based on the 3GPP Rel 17 specification for global connectivity.