December 2, 2024 - Electronic Design Today

112G SerDes and retimers are needed for copper cabling to hit 800G speeds.

The Treo Platform features a modular architecture to accelerate development of intelligent power management, sensor interface, and communications solutions.

It’s not AI, but teleoperated robots, which are the major threat to skilled trades’ and manufacturing workers’ jobs.

A successful model-based engineering effort for rugged system infrastructure design will result in shorter development cycles, fewer failures and rework, more innovation, and ...

This article maps out how high-performance computing technologies can be constructed into modern embedded systems, focusing on the usability of open standards-based computing ...

Reliable communications, at-the-edge AI processing, and a wider range of environmental conditions are just some of the aspects that rugged systems designers need to account for...

Finding an exact test system for your SOSA-aligned system requirement doesn’t have to break the bank. There are creative ways to keep your development costs and lead times lower...

Thermal management is critical for rugged-systems design, where SWaP-C (size, weight, power, and cost) constraints require innovative cooling strategies.

These ICs, developed by Renesas, provide the critical IC functionality and support needed for implementation of industrial I/O and protocols.

TSMC will funnel the funds toward construction of a trio of Arizona-based semiconductor manufacturing plants in efforts to help America retake the silicon crown.

A brief overview of the history and operating principles of vacuum tubes is discussed, after which Dr. Stephen Dyer shows how to model them in SPICE in their active region of ...

Optimizing drivetrain and inverter performance of a design requires characterizing the gate-driver signals, especially in multiphase, which can be very challenging.

The latest isolated oscilloscope probes from Tektronix use robust isolation to measure the fast-changing currents in power electronics based on SiC and GaN.

GaN switches promise higher efficiency and higher power density in SMPS. This article discusses the readiness of this technology and its challenges, and provides an outlook on...

Lake Shore Cryotronics' SMU module for its M81-SSM instrument brings laboratory-grade, low-level measurement capabilities to a benchtop instrument.

Rapid prototyping requires quick access to new peripherals—de facto standards can help.

Autonomous vehicles can’t become fully reliable until they precisely know their location. Here’s how real-time kinematic integration provides the accuracy needed to propel self...

Renesas, in collaboration with Nidec, developed the first “8-in-1” proof of concept for E-Axle systems that will help simplify electric-vehicle design. It controls eight functions...