Higher levels of integration and ingenious power-conversion architectures are enabling simpler, denser, more efficient solutions for EVs, data centers, and other critical applications...
SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power densities while reducing solution cost. Meanwhile, silicon...
The results are in—Electronic Design’s readers have spoken. We present the top analog articles of 2024, as well as invite you, our readers, to become contributing authors.
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