February 3, 2025 - Electronic Design Today

From IoT breakthroughs to energy-harvesting chips, CES 2025 showcased the latest technology that’s set to shape our lives. Here’s a look at some of the tech that stood out at ...

The new standard will enable companies to design custom chiplets within a shared interconnect ecosystem.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Infineon’s full/half-bridge driver ICs are qualified for automotive applications, feature a wide temperature range, and have Arduino Uno evaluation shields available.

Advanced RF pulsing, direct match-generator synchronization, and impedance-matching technology are critical to achieving precision in angstrom-scale semiconductor manufacturing...